The second scientific workshop
presented by the 26th URSI-C in Japan

Session title:
"R&D Trends in High-Frequency Circuits for the 6G EraG
--- Active circuits section ---"


1. Convener: Prof. Kensuke Okubo (Okayama Prefectural University)

2. Date/time: July 5th, 2024 / 14:00 - 17:00

3. Venue: Toyako Cultural Center (Annex Second Meeting Room), Toyako Town, Abuta-gun, Hokkaido
(Hybrid conference with web conference)

4. Registration fee: Free

5. Listed attendees: On site: 16 persons，Online: 12 persons

6. Local arrangement: Junji Sato (Panasonic Corp.)

7. Session title: "R & D Trends in High-Frequency Circuits for the 6G the Era
--- Active circuits section ---"

8. Presentations:
  • 14:00 - 14:15 Opening Remarks
    Prof. Mitoshi Fujimoto, Chair, Commission C of URSI-JNC
    (University of Fukui)
  • 14:15 - 15:05 "Amplifier technology contributing to the realization of 6G"
    Dr. Koji Yamanaka (Mitsubishi Electric, Co., Ltd.)
  • 15:05 - 15:55 "100Gbps/100m wireless transmission system using
    wideband 300 GHz mixer by InP HEMT"
    Dr. Teruo Jyo (NTT Device Technology Labs, NTT Corp.)
  • 15:55 - 16:10 Coffee Break (15 min.)
  • 16:10 - 17:00 "Millimeter-wave band antenna integrated module technology"
    Dr. Hideki Ueda (Murata Manufacturing Co., Ltd.)
  • 17:00Closing

9．Reception:
It held from 18:30 to 20:30 at Toya Kanko Hotel in Toyako Town, Abuta-gun, Hokkaido. The number of attendees was 15.

10．The Steering committee meeting:
It took place from 8:30 to 9:30 on July 6th, 2024, at Toya Kanko Hotel.

11. Concluding Remarks
Research and development activities for wireless system and hardware for the 6G era are progressing. This workshop was organized to discuss the latest R&D trends in the hardware that constitutes wireless systems, particularly in high-frequency active circuits, and to share the state-of-the-art research status in Japan.
First, Dr. Koji Yamanaka (Mitsubishi Electric, Co., Ltd.) presented an overview of 5G sub-& BTS amplifiers; Ka-band Doherty GaN MMIC for mmW 5G base stations and Ka-band GaN MMICs for sat-com terminals; and future prospects for mnW wave and THz GaN devices based on the Japanese national policies for beyond 5G and 6G developments.
Second, Dr. Teruo Jyo (NTT Device Technology Labs, NTT Corp.) presented the design and evaluation of a 300-GHz broadband mixer and PA using InP HEMT and the demonstration of dual-band 240-Gbps data transmission; the construction of a 300-GHz transmitter/receiver and the demonstration of 100-Gbps, 100-m transmission.
Finally, Dr. Hideki Ueda (Murata Manufacturing Co., Ltd.) presented the antenna array integrated module (AiM), which integrates RFIC and antenna; packaging technology to realize high value-added AiM; and multi-layer and low-loss substrate material technology to achieve higher efficiency and smaller AiM.
The above are important technologies for the realization of the 6G era, and this workshop was very useful to share with the participants the research directions and subjects related to the R&D trends in high-frequency circuits, particularly active circuits, for the 6G era.




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