1. Convener: Dr. Kenjiro Nishikawa, NTT Network Innovation Laboratories, NTT Corporation

2. Date/time: 13:30 - 18:00, 4-June.-2010

3. Venue: Tokushima University, Tokushima, Japan

4. Registration fee: Free

5. Listed attendees: 29 persons

6. Local arrangement: Prof. Yasuo Ohno (Tokushima University)

7. Session title: "High-speed/High frequency Packaging and Board Design Techniques"

8. Presentation: 50 min including Q&A for each speaker

• Opening Talk, Dr. Kenji Itoh URSI-C-Japan, Chair
• " Design, Modeling and Analysis Collaboration for SI (Signal Integrity) of high-speed signal transmission", Dr. Keitaro Yamagishi, Mitsubishi Electric Corp.
• "EBG Structures for Reducing Electromagnetic Noises in PCB", Dr. Naoki Kobayashi, NEC
• "Millimeter-wave On-chip/Package-integrated Antenna", Dr. Kenjiro Nishikawa, NTT Corporation
• Tutorial presentation "GaN Power Device", Prof. Masaaki Kuzuhara, Fukui University

9. Reception and Lamp Session at Kanpo-no-yado Tokushima, Tokushima, Japan. Banquet

10. The steering committee meeting took place from 08:00 to 9:00 on 5-June-2010

11. Concluding Remarks
This workshop was entitled "High-speed/High frequency Packaging and Board Design Techniques " and had three talks. Design techniques for high-speed board and millimeter-wave highly-integrated packaging with antennas were discussed. Tutorial talk for GaN power device was also presented. In the lamp session, we deeply discussed two-dimensional FD-TD method for analysis of planar circuits